The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Jun. 23, 2017
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventor:

Hiroki Shinkawata, Tokyo, JP;

Assignee:

Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01); H01L 29/78 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0653 (2013.01); H01L 21/76283 (2013.01); H01L 29/6653 (2013.01); H01L 29/66477 (2013.01); H01L 29/66492 (2013.01); H01L 29/66628 (2013.01); H01L 29/66772 (2013.01); H01L 29/78 (2013.01); H01L 29/78606 (2013.01); H01L 29/78654 (2013.01); H01L 21/2652 (2013.01); H01L 29/665 (2013.01);
Abstract

In an SOI substrate having a semiconductor substrate serving as a support substrate, an insulating layer on the semiconductor substrate and a semiconductor layer on the insulating layer, an element isolation region which penetrates the semiconductor layer and the insulating layer and whose bottom part reaches the semiconductor substrate is formed, and a gate electrode is formed on the semiconductor layer via a gate insulating film. A divot is formed in the element isolation region at a position adjacent to the semiconductor layer, and a buried insulating film is formed in the divot. The gate electrode includes a part formed on the semiconductor layer via the gate insulating film, a part located on the buried insulating film and a part located on the element isolation region.


Find Patent Forward Citations

Loading…