The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Apr. 06, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Bhaskar Kumar, Santa Clara, CA (US);

Prashanth Kothnur, San Jose, CA (US);

Sidharth Bhatia, Santa Cruz, CA (US);

Anup Kumar Singh, Santa Clara, CA (US);

Vivek Bharat Shah, Sunnyvale, CA (US);

Ganesh Balasubramanian, Sunnyvale, CA (US);

Changgong Wang, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32477 (2013.01); H01J 37/32091 (2013.01); H01J 37/32385 (2013.01); H01J 37/32642 (2013.01); H01J 2237/022 (2013.01); H01J 2237/3321 (2013.01);
Abstract

Implementations of the present disclosure generally relate to an apparatus for reducing particle contamination on substrates in a plasma processing chamber. The apparatus for reduced particle contamination includes a chamber body, a lid coupled to the chamber body. The chamber body and the lid define a processing volume therebetween. The apparatus also includes a substrate support disposed in the processing volume and an edge ring. The edge ring includes an inner lip disposed over a substrate, a top surface connected to the inner lip, a bottom surface opposite the top surface and extending radially outward from the substrate support, and an inner step between the bottom surface and the inner lip. To avoid depositing the particles on the substrate being processed when the plasma is de-energized, the edge ring shifts the high plasma density zone away from the edge area of the substrate.


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