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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10790094 B1

PDFFull Text
Date of Patent:
Sep. 29, 2020

Filed:

Jun. 28, 2019

Method of forming a leadless stack comprising multiple components

Applicant:

Kemet Electronics Corporation, Simpsonville, SC (US);

Inventors:

John E. McConnell, Simpsonville, SC (US);

Garry L. Renner, Simpsonville, SC (US);

John Bultitude, Simpsonville, SC (US);

R. Allen Hill, Simpsonville, SC (US);

Galen W. Miller, Simpsonville, SC (US);

Assignee:

KEMET Electronics Corporation, Fort Lauderdale, FL (US);

Attorneys:

Joseph T. Guy

Patent Filing Specialist, Inc.

Primary Examiner:

Minh N Trinh

Int. Cl.
CPC ...
H01G 4/40 (2006.01); H01G 4/30 (2006.01); H01G 4/232 (2006.01); H01G 4/002 (2006.01); H01G 4/38 (2006.01); B23K 35/36 (2006.01); B23K 20/00 (2006.01); B23K 20/02 (2006.01); B23K 20/16 (2006.01); B23K 20/22 (2006.01); B23K 35/02 (2006.01); H01G 4/012 (2006.01); H01G 4/248 (2006.01); H01G 4/12 (2006.01); B22F 3/10 (2006.01); H01G 4/008 (2006.01); B23K 101/40 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01G 4/40 (2013.01); B23K 20/002 (2013.01); B23K 20/026 (2013.01); B23K 20/16 (2013.01); B23K 20/22 (2013.01); B23K 35/0227 (2013.01); B23K 35/3613 (2013.01); H01G 4/002 (2013.01); H01G 4/232 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01); H01G 4/38 (2013.01); B22F 3/1035 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08); H01G 4/0085 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/1227 (2013.01); H01G 4/248 (2013.01); H01L 2224/83825 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/1461 (2013.01); Y10T 29/435 (2015.01);
Abstract

A method of forming a leadless stack comprising multiple components is provided. The method comprises forming an MLCC comprising a first capacitor external termination and a second capacitor external termination and forming an electronic element is formed comprising a first element external termination and a second element external termination. The MLCC and electronic component are are arranged in a stack with a TLPS bond between the first capacitor external termination and the first element external termination.

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