The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2020
Filed:
Oct. 30, 2018
Nxp Usa, Inc., Austin, TX (US);
Stanley Job Doraisamy, Seremban, MY;
Meng Kong Lye, Shah Alam, MY;
Norazham Mohd Sukemi, Subang Jaya, MY;
NXP USA, Inc., Austin, TX (US);
Abstract
A semiconductor sensor device includes a lead frame flag having a vent hole, an interposer mounted on the flag and having a vent hole in fluid communication with the vent hole of the flag, and a sensor die having an active region. The sensor die is mounted on and electrically connected to the interposer in a flip-chip manner such that the vent hole of the interposer is in fluid communication with the active region of the sensor die. Bond wires electrically connect the interposer to one or more other components of the device. A molding compound covers the sensor die, the interposer, and the bond wires. The sensor die may be a pressure-sensing (P-cell) die, and the device may also include a micro-controller unit (MCU) die and an acceleration-sensing (G-cell) die, for tire pressure monitoring applications.