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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10784642 B1

PDFFull Text
Date of Patent:
Sep. 22, 2020

Filed:

Jul. 31, 2018

Flexible printed wiring board, electronic device having flexible printed wiring board, and method for manufacturing electronic device having flexible printed wiring board

Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventors:

Takahisa Hirasawa, Ogaki, JP;

Takayuki Furuno, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Amanda C Walke

Int. Cl.
CPC ...
H01R 43/20 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); B23K 26/21 (2014.01); H01R 43/02 (2006.01); H01R 12/65 (2011.01); B23K 103/04 (2006.01); B23K 101/36 (2006.01); H05K 3/32 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H01R 43/205 (2013.01); B23K 26/21 (2015.10); H01R 43/0221 (2013.01); H05K 1/028 (2013.01); H05K 1/09 (2013.01); H05K 1/189 (2013.01); H05K 3/005 (2013.01); B23K 2101/36 (2018.08); B23K 2103/05 (2018.08); H01R 12/65 (2013.01); H01R 43/0214 (2013.01); H05K 3/328 (2013.01); H05K 3/4046 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/10037 (2013.01); H05K 2201/10242 (2013.01); H05K 2201/10295 (2013.01);
Abstract

A flexible printed wiring board includes a flexible insulating layer, a conductor layer formed on a surface of the flexible insulating layer, and a metal body having a columnar shape and fitted in a hole penetrating through the flexible insulating layer and the conductor layer such that the metal body is formed of a welding base material and has an end portion formed to be joined to an electrode of a battery by welding. The welding base material of the metal body of the flexible printed wiring board includes the same material as the electrode of the battery.

Find Patent Forward Citations

Quick Actions:

Hirasawa, Takahisa. (2020). Flexible printed wiring board, electronic device having flexible printed wiring board, and method for manufacturing electronic device having flexible printed wiring board (U.S. Patent No. 10784642). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10784642

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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