The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Aug. 18, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Rwik Sengupta, Austin, TX (US);

Andrew Paul Hoover, Austin, TX (US);

Matthew Berzins, Cedar Park, TX (US);

Sam Tower, Austin, TX (US);

Mark S. Rodder, Dallas, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 27/02 (2006.01); H01L 23/522 (2006.01); H01L 21/3213 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01); H01L 21/321 (2006.01); H01L 23/532 (2006.01); H01L 27/118 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5286 (2013.01); H01L 21/31111 (2013.01); H01L 21/3212 (2013.01); H01L 21/32133 (2013.01); H01L 21/7684 (2013.01); H01L 21/76805 (2013.01); H01L 21/76843 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 27/0207 (2013.01); H01L 23/53209 (2013.01); H01L 23/53228 (2013.01); H01L 23/53242 (2013.01); H01L 2027/11881 (2013.01);
Abstract

A semiconductor integrated circuit including a substrate, a series of metal layers, and a series of insulating layers. The metal layers and the insulating layers are alternately arranged in a stack on the substrate. The semiconductor integrated circuit also includes at least two standard cells in the substrate and at least one power rail crossing over boundaries of the at least two standard cells. The power rail includes a vertical section of conductive material extending continuously through at least two vertical levels of the stack. The two vertical levels of the stack include one metal layer and one insulating layer. The insulating layer is above the metal layer.


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