The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Apr. 20, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Eng Sheng Peh, Singapore, SG;

Karthik Balakrishnan, Chennai, IN;

Sriskantharajah Thirunavukarasu, Singapore, SG;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G06T 7/00 (2017.01); H01L 21/677 (2006.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67288 (2013.01); G06T 7/0004 (2013.01); H01L 21/6773 (2013.01); H01L 21/67155 (2013.01); H01L 21/67265 (2013.01); H01L 21/681 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Methods and apparatus for detecting warpage in a substrate are provided herein. In some embodiments, a warpage detector for detecting warpage in substrates includes: one or more light sources to illuminate one or more substrates when present; a camera for capturing images of exposed portions of one or more substrates when present; a motion assembly having a mounting stage for supporting the camera; and a data acquisition interface (DAI) coupled to the camera to process substrate images and detect warpage of substrates based upon the processed substrate images.


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