The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
Aug. 29, 2017
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 18/16 (2006.01); C23C 18/28 (2006.01); C23C 18/30 (2006.01); C23C 18/18 (2006.01); H01L 21/288 (2006.01);
U.S. Cl.
CPC ...
H01L 21/288 (2013.01); C23C 18/1619 (2013.01); C23C 18/1675 (2013.01); C23C 18/18 (2013.01); C23C 18/285 (2013.01); C23C 18/30 (2013.01);
Abstract
A substrate W having a non-plateable material portionand a plateable material portionformed on a surface thereof is prepared, and then, a catalyst is imparted selectively to the plateable material portionby supplying a catalyst solution Nonto the substrate W. Thereafter, a plating layeris selectively formed on the plateable material portionby supplying a plating liquid Monto the substrate W. A pH of the catalyst solution Nis previously adjusted such that the plating layeris suppressed from being precipitated on the non-plateable material portionwhile being facilitated to be precipitated on the plateable material portion