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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10784100 B1

PDFFull Text
Date of Patent:
Sep. 22, 2020

Filed:

Jul. 14, 2017

Back-side friction reduction of a substrate

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Hoyoung Kang, Guilderland, NY (US);

Assignee:

Tokyo Electron Limited, Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Cynthia Hamilton

Int. Cl.
CPC ...
H01L 21/02 (2006.01); G03F 7/42 (2006.01); H01L 21/027 (2006.01); H01L 21/67 (2006.01); G03F 7/09 (2006.01); G03F 7/16 (2006.01); H01L 21/306 (2006.01); H01L 21/687 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02016 (2013.01); G03F 7/092 (2013.01); G03F 7/167 (2013.01); G03F 7/42 (2013.01); G03F 7/427 (2013.01); H01L 21/0274 (2013.01); H01L 21/306 (2013.01); H01L 21/67196 (2013.01); H01L 21/67207 (2013.01); H01L 21/687 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01);
Abstract

A processing chamber system includes a substrate mounting module configured to secure a substrate within a first processing chamber. The system also includes a first deposition module configured to apply a light-sensitive film to a front side surface of the substrate, and a second deposition module configured to apply a film layer to a backside surface of the substrate. The front side surface is opposite to the backside surface of the substrate. A substrate has a bare backside surface with a first coefficient of friction. A film layer is formed onto the backside surface of the substrate. The film layer formed on the backside surface of the substrate has a second coefficient of friction. The second coefficient of friction is lower than the first coefficient of friction.

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