The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
Oct. 23, 2017
Applicant:
Te Connectivity Corporation, Berwyn, PA (US);
Inventor:
Brian Ward Guilardi, San Jose, CA (US);
Assignee:
TE CONNECTIVITY CORPORATION, Berwyn, PA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 19/04 (2006.01); B81B 7/00 (2006.01); G01L 9/00 (2006.01); G01L 19/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0061 (2013.01); B81C 1/00309 (2013.01); G01L 9/0042 (2013.01); G01L 9/0054 (2013.01); G01L 9/0055 (2013.01); G01L 19/0069 (2013.01); G01L 19/04 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/098 (2013.01); B81C 2203/035 (2013.01);
Abstract
A pressure sensor assembly includes a sensor die and a ceramic substrate. The sensor die has a first side and a second side that is opposite to the first side. The sensor die includes a silicon chip that has a diaphragm configured to be exposed to a working fluid. The sensor die includes one or more electrical sensing elements mounted on the diaphragm and configured to measure a pressure of the working fluid. The sensor die is mounted to the ceramic substrate via a solder layer that engages the ceramic substrate and the second side of the sensor die.