The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
Apr. 28, 2017
Shanghai Micro Electronics Equipment (Group) Co., Ltd., Shanghai, CN;
Hui Fu, Shanghai, CN;
Feixiang Shang, Shanghai, CN;
Shanghai Micro Electronics Equipment (Group) Co., Ltd., Shanghai, CN;
Abstract
A bonding device includes a flexible platen disposed between an upper platen assembly () and a transmission device and within a vacuum chamber (). The flexible platen can expand to apply a downward pressure to the upper platen assembly () connected thereto. Under the effect of the pressure, the upper platen assembly () slowly moves downward until the upper platen assembly () itself and a lower platen assembly () respectively come into tight contact with objects to be bonded. After that, the flexible platen continues exerting the downward pressure on the upper platen assembly (). In this way, the pressure applied by the upper platen assembly () to the objects to be bonded is uniform. Meanwhile, because of slow expansion of the flexible platen, the uniform pressure is applied slowly by the upper platen assembly ().
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile