The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Apr. 30, 2019
Chunghwa Precision Test Tech. Co., Ltd., Taoyuan, TW;
Yi-Chun Chen, Taoyuan, TW;
Chao-Chiang Liu, Taoyuan, TW;
CHUNGHWA PRECISION TEST TECH. CO., LTD., Taoyuan, TW;
Abstract
A multilayer circuit board and a manufacturing method thereof are provided. The multilayer circuit board includes: a first board having a first conductive via hole; a first conductive layer formed on the first board and the first conductive via hole; a second board disposed on the first board and the first conductive layer and having a second conductive via hole; and a second conductive layer formed on the second board and the second conductive via hole. The first conductive layer and the second conductive layer contact with each other and cooperatively define a connecting part, and the connecting part of the first conductive layer and the second conductive layer includes concave-convex surfaces for engaging with each other.