The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Feb. 13, 2019
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Hayato Nasu, Tokyo, JP;
Yasushi Itabashi, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Abstract
According to one embodiment, the interconnect layers include a first interconnect layer and a second interconnect layer. The second interconnect layer is provided on the first interconnect layer. The insulating layer is provided between the plurality of interconnect layers. The barrier metal film is provided at a surface of the first interconnect layer but not provided at a surface of the second interconnect layer. The plugs connect the first interconnect layer and the second interconnect layer, and are provided between the first interconnect layer and the second interconnect layer. The plugs are arranged at a spacing of 200 μm or less along a longitudinal direction of the second interconnect layer.