The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2020
Filed:
Jul. 13, 2017
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Bernd Karl Appelt, Kaohsiung, TW;
Kay Stefan Essig, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 21/768 (2006.01); H01L 23/367 (2006.01); H01L 23/48 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3135 (2013.01); H01L 21/486 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 21/568 (2013.01); H01L 21/76805 (2013.01); H01L 21/76879 (2013.01); H01L 23/3128 (2013.01); H01L 23/3142 (2013.01); H01L 23/3157 (2013.01); H01L 23/367 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/82 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 23/145 (2013.01); H01L 23/3677 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/211 (2013.01); H01L 2224/215 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/32146 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92144 (2013.01); H01L 2224/96 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06582 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01);
Abstract
A semiconductor package device includes a first die having a first surface and a second surface opposite to the first surface, and a first adhesive layer disposed on the first surface of the first die. The semiconductor package device further includes an encapsulant layer encapsulating the first die and the first adhesive layer, and a first conductive via disposed in the first adhesive layer and electrically connected to the first die.