The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Nov. 22, 2017
Applicant:

United Microelectronics Corp., Hsinchu, TW;

Inventors:

Li-Chin Wang, Tainan, TW;

Ya-Ching Cheng, Hsinchu, TW;

Chien-Hung Chen, Xinpu Township, Hsinchu County, TW;

Chun-Liang Hou, Zhubei, TW;

Da-Ching Liao, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/00 (2019.01); G06F 16/28 (2019.01); G05B 19/418 (2006.01);
U.S. Cl.
CPC ...
G06F 16/285 (2019.01); G05B 19/4183 (2013.01); G05B 2219/31318 (2013.01);
Abstract

A manufacture parameters grouping and analyzing method, and a manufacture parameters grouping and analyzing system are provided. The manufacture parameters grouping and analyzing method includes the following steps: A plurality of process factors are classified into a plurality of groups. In each of the groups, an intervening relationship between any two of the process factors is larger than a predetermined correlation value. In each of the groups, at least one representative factor is selected from each of the groups according to a plurality of outputting relationships of the process factors related to an output factor or a plurality of sample amounts of the process factors. Finally, the representative factor is used for various applications.


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