The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Aug. 21, 2015
Applicant:

Lintec Corporation, Tokyo, JP;

Inventors:

Hidekazu Nakayama, Tokyo, JP;

Masami Matsui, Tokyo, JP;

Mikihiro Kashio, Tokyo, JP;

Assignee:

LINTEC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/5435 (2006.01); C09J 183/04 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); H01L 33/56 (2010.01); C09K 3/10 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); C08L 83/04 (2006.01); C08K 3/00 (2018.01); C08K 3/36 (2006.01); C08K 5/544 (2006.01); C08K 5/548 (2006.01); H01L 31/0203 (2014.01); C08G 77/18 (2006.01); C08G 77/16 (2006.01); H01S 5/022 (2006.01);
U.S. Cl.
CPC ...
C09J 183/04 (2013.01); C08K 3/00 (2013.01); C08K 3/36 (2013.01); C08K 5/548 (2013.01); C08K 5/5435 (2013.01); C08K 5/5442 (2013.01); C08L 83/04 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09K 3/10 (2013.01); H01L 23/29 (2013.01); H01L 23/31 (2013.01); H01L 31/0203 (2013.01); H01L 33/56 (2013.01); C08G 77/16 (2013.01); C08G 77/18 (2013.01); C08K 2201/005 (2013.01); H01L 2924/0002 (2013.01); H01S 5/02228 (2013.01);
Abstract

The present invention is: a curable composition comprising a component (A), a component (B), and a component (C), the curable composition comprising the component (A) and the component (B) in a mass ratio (component (A):component (B)) of 100:0.3 to 100:50, the component (A) being a curable polysilsesquioxane compound that comprises a repeating unit represented by a formula (a-1),RSiO  (a-1)wherein Ris a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, or a substituted or unsubstituted aryl group, the component (B) being fine particles having an average primary particle size of 5 to 40 nm, and the component (C) being a silane coupling agent that comprises an acid anhydride structure in its molecule. This invention provides: a curable composition that produces a cured product that exhibits excellent adhesion, excellent delamination resistance, and excellent heat resistance, and exhibits excellent workability during the application step, a method for producing the same, a cured product obtained by curing the curable composition, a method for using the curable composition as an optical element-securing adhesive or an optical element sealing material, and an optical device.


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