IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10774237 B1

PDFFull Text
Date of Patent:
Sep. 15, 2020

Filed:

Sep. 23, 2016

Thermosetting resin composition

Applicant:

Nissan Chemical Industries, Ltd., Tokyo, JP;

Inventors:

Takahiro Sakaguchi, Funabashi, JP;

Yuki Sugawara, Funabashi, JP;

Isao Adachi, Funabashi, JP;

Assignee:

NISSAN CHEMICAL INDUSTRIES, LTD., Tokyo, JP;

Attorney:

Harris A. Pitlick

Primary Examiner:

Robert S Walters, Jr

Int. Cl.
CPC ...
C09D 163/10 (2006.01); C08F 283/01 (2006.01); C08F 220/14 (2006.01); C09D 167/06 (2006.01); C08F 120/36 (2006.01); C08G 59/14 (2006.01); C08F 299/04 (2006.01); C08G 63/685 (2006.01); C08F 212/08 (2006.01); C09D 7/63 (2018.01); B05D 3/02 (2006.01); C08G 59/17 (2006.01);
U.S. Cl.
CPC ...
C09D 163/10 (2013.01); B05D 3/0254 (2013.01); C08F 120/36 (2013.01); C08F 212/08 (2013.01); C08F 220/14 (2013.01); C08F 283/01 (2013.01); C08F 299/04 (2013.01); C08G 59/14 (2013.01); C08G 59/1466 (2013.01); C08G 63/6858 (2013.01); C09D 7/63 (2018.01); C09D 167/06 (2013.01); C08L 2203/16 (2013.01); C08L 2203/206 (2013.01);
Abstract

A thermosetting resin composition, a thermosetting resin composition for protective films, a thermosetting resin composition for planarizing films, and a method for producing a cured film, a protective film, or a planarizing film by using the resin composition. A thermosetting resin composition has a polymer having a structural unit of Formula (1) below, a curing agent in an amount of 0% by mass to 30% by mass with respect to the polymer, and a solvent. When the thermosetting resin composition includes the curing agent, the curing agent is at least one compound selected from polyfunctional (meth)acrylate compounds and polyfunctional blocked isocyanate compounds: (wherein Ais a Cor Calkenyl group or alkynyl group, and Ais a Calkenylene group or alkynylene group).

Find Patent Forward Citations

Loading…