The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Mar. 07, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Hou T. Ng, San Jose, CA (US);

Nag B. Patibandla, Pleasanton, CA (US);

Rajeev Bajaj, Fremont, CA (US);

Daniel Redfield, Morgan Hill, CA (US);

Ashwin Chockalingam, San Jose, CA (US);

Mayu Yamamura, San Carlos, CA (US);

Mario Cornejo, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B33Y 10/00 (2015.01); G03F 7/00 (2006.01); G03F 7/20 (2006.01); B33Y 30/00 (2015.01); B33Y 80/00 (2015.01); B24B 37/22 (2012.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B33Y 10/00 (2014.12); B24B 37/22 (2013.01); B33Y 30/00 (2014.12); B33Y 80/00 (2014.12); G03F 7/0035 (2013.01); G03F 7/2014 (2013.01); B29K 2105/0058 (2013.01);
Abstract

A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.


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