The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2020

Filed:

Apr. 05, 2016
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Atsushi Komatsu, Tokyo, JP;

Atsushi Takagi, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B26D 3/06 (2006.01); H01L 21/78 (2006.01); H01L 21/66 (2006.01); H01L 21/304 (2006.01); G01B 11/22 (2006.01);
U.S. Cl.
CPC ...
B26D 3/065 (2013.01); H01L 21/78 (2013.01); H01L 22/20 (2013.01); G01B 11/22 (2013.01); H01L 21/3043 (2013.01); H01L 22/12 (2013.01);
Abstract

A cut groove having a predetermined depth is formed with a cutting blade along a projected dicing line set on a workpiece. A first preliminary groove is cut in a measurement member and a relational expression with respect to a distance from the preliminary groove bottom and the width of the preliminary groove is determined. An amount of incision into the workpiece is set to be equal to or smaller than a predetermined value from a reference position and the thickness of the workpiece. A second preliminary groove is cut along the projected dicing line, and an image of the second preliminary cut groove is captured. The width of the second preliminary cut groove is measured, and the depth of the second preliminary cut groove is calculated from the width of the second preliminary groove and the relational expression.


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