The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
Mar. 29, 2017
Applicants:
Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;
Semiconductor Manufacturing International (Beijing) Corporation, Beijing, CN;
Inventor:
Qi Liu, Shanghai, CN;
Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); H01L 23/00 (2006.01); B23K 20/26 (2006.01); B23K 101/40 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01L 24/78 (2013.01); B23K 20/004 (2013.01); B23K 20/26 (2013.01); H01L 24/85 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08); H01L 24/48 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/78251 (2013.01); H01L 2224/78621 (2013.01); H01L 2224/78701 (2013.01); H01L 2224/78704 (2013.01); H01L 2224/78804 (2013.01); H01L 2224/852 (2013.01); H01L 2224/85181 (2013.01);
Abstract
A clamping system, a wire bonding machine and a method for bonding wires are provided. An exemplary clamping system includes a clamping device. The clamping device includes: at least one linear guide rail; a first clamping rod arranged perpendicular to the linear guide rail; and a second clamping rod arranged perpendicular to the linear guide rail and parallel to the first clamping rod.