The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
Oct. 15, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Takuya Kitabayashi, Tokyo, JP;
Hiroshi Yoshida, Tokyo, JP;
Hidetoshi Ishibashi, Tokyo, JP;
Daisuke Murata, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/31 (2006.01); H01L 23/12 (2006.01); H01L 23/58 (2006.01); H01L 23/492 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3142 (2013.01); H01L 23/02 (2013.01); H01L 23/12 (2013.01); H01L 23/492 (2013.01); H01L 23/585 (2013.01);
Abstract
A semiconductor apparatus includes: a substrate including a circuit pattern on an upper surface side and a metal plate on a lower surface side; a semiconductor device joined to the circuit pattern via a conductive component; a case located to surround the substrate; a sealing material sealing the semiconductor device and the substrate in a section surrounded by the case; and a bonding agent bonding the case and the metal plate on a side face of the substrate.