The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2020
Filed:
Nov. 05, 2018
Ebara Corporation, Tokyo, JP;
Mitsuhiro Shamoto, Tokyo, JP;
Masashi Shimoyama, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
The present disclosure provides techniques for determining plating conditions by numerically analyzing a film-thickness distribution. The disclosed techniques comprise performing electrochemical measurement in an electroplating apparatus; determining electrochemical parameters based on a result of the electrochemical measurement; receiving initial plating conditions for performing a plating process; based on the electrochemical parameters and the initial plating conditions, determining a current density distribution on a surface of a substrate based on a function formula which comprises a variable which represents a position on the substrate; based on the current density distribution, calculating a thickness of a film to be plated on the substrate; and performing the plating process based on final plating conditions corresponding to a calculated film-thickness distribution satisfying a desired film-thickness distribution.