The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2020

Filed:

Feb. 14, 2018
Applicant:

U.s. Army Research Laboratory Attn: Rdrl-loc-i, Adelphi, MD (US);

Inventors:

Laszlo J. Kecskes, Havre De Grace, MD (US);

Kristopher A. Darling, Havre De Grace, MD (US);

Rajiv S. Mishra, Denton, TX (US);

Yuri Mishin, Centreville, VA (US);

Kiran N. Solanki, Tempe, AZ (US);

Mansa Rajagopalan, San Ramon, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 9/00 (2006.01); B22F 9/12 (2006.01); B22F 9/14 (2006.01); C22C 9/00 (2006.01); B22F 9/04 (2006.01); B22F 1/00 (2006.01); C22C 1/04 (2006.01); B82Y 40/00 (2011.01); B22F 3/20 (2006.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
B22F 9/002 (2013.01); B22F 1/0044 (2013.01); B22F 9/04 (2013.01); B22F 9/12 (2013.01); B22F 9/14 (2013.01); C22C 1/0425 (2013.01); C22C 9/00 (2013.01); B22F 3/20 (2013.01); B22F 2009/041 (2013.01); B22F 2009/043 (2013.01); B22F 2202/03 (2013.01); B22F 2301/10 (2013.01); B22F 2301/155 (2013.01); B22F 2301/205 (2013.01); B22F 2301/25 (2013.01); B22F 2301/35 (2013.01); B22F 2304/054 (2013.01); B22F 2999/00 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); C22C 2200/04 (2013.01); C22C 2202/00 (2013.01);
Abstract

Novel metallic systems and methods for their fabrication provide an extreme creep-resistant nano-crystalline metallic material. The material comprises a matrix formed of a solvent metal with crystalline grains having diameters of no more than about 500 nm, and a plurality of dispersed metallic particles formed on the basis of a solute metal in the solvent metal matrix and having diameters of no more than about 200 nm. The particle density along the grain boundary of the matrix is as high as about 2 nmof grain boundary area per particle so as to substantially block grain boundary motion and rotation and limit creep at temperatures above 35% of the melting point of the material.


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