The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Jan. 21, 2017
Applicant:
At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Inventors:
Jonathan Silvano De Sousa, Vienna, AT;
Nick Renaud-Bezot, Vienna, AT;
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01); H01L 41/09 (2006.01); H01L 41/312 (2013.01); H04R 17/00 (2006.01); H01L 41/311 (2013.01); H04R 31/00 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); H01L 41/047 (2006.01); H01L 41/113 (2006.01);
U.S. Cl.
CPC ...
H01L 41/053 (2013.01); B81B 3/0021 (2013.01); B81C 1/00333 (2013.01); H01L 41/0477 (2013.01); H01L 41/09 (2013.01); H01L 41/0973 (2013.01); H01L 41/113 (2013.01); H01L 41/311 (2013.01); H01L 41/312 (2013.01); H04R 17/00 (2013.01); H04R 31/00 (2013.01); B81B 2201/0235 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/012 (2013.01); H04R 2201/003 (2013.01);
Abstract
A microelectro-mechanical system (MEMS) device includes a support structure formed of printed circuit board (PCB) materials; and a piezoelectric transducer formed at the support structure. Further, a MEMS assembly is described which shows such a MEMS device mounted at a component carrier. Furthermore, a method for manufacturing such a MEMS device is described.