The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Mar. 07, 2019
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Hiroshi Ohno, Osaka, JP;

Kenya Yamashita, Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/22 (2010.01); H01L 33/00 (2010.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
H01L 33/22 (2013.01); H01L 33/0075 (2013.01); H01L 33/325 (2013.01);
Abstract

A flip-chip light emitting diode element capable of reducing lateral resistance. The flip-chip light emitting diode element includes a stacked body structure configured by sequentially stacking a first n-type group III nitride semiconductor layer having a carrier concentration that is at least 1×10cmbut less than 3×10cm, a second n-type group III nitride semiconductor layer having a carrier concentration that is at least 5×10cmbut less than 1×10cm, a light-emitting layer formed by a group III nitride semiconductor, and a p-type group III nitride semiconductor layer. A height of unevenness on an interface between the first n-type group III nitride semiconductor layer and the second n-type group III nitride semiconductor layer is greater than that of unevenness of an interface between the second n-type group III nitride semiconductor layer and the light emitting layer.


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