The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Mar. 21, 2019
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Masaki Tsuji, Yokkaichi, JP;

Yoshiaki Fukuzumi, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11582 (2017.01); H01L 29/66 (2006.01); H01L 29/792 (2006.01); H01L 27/11556 (2017.01); H01L 27/11578 (2017.01); H01L 27/11531 (2017.01); H01L 27/11524 (2017.01); H01L 27/11529 (2017.01); H01L 27/11565 (2017.01); H01L 27/11597 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 27/11524 (2013.01); H01L 27/11529 (2013.01); H01L 27/11531 (2013.01); H01L 27/11556 (2013.01); H01L 27/11565 (2013.01); H01L 27/11578 (2013.01); H01L 27/11597 (2013.01); H01L 29/66666 (2013.01); H01L 29/66833 (2013.01); H01L 29/7926 (2013.01);
Abstract

According to an embodiment, a non-volatile memory device includes a first conductive layer, electrodes, an interconnection layer and at least one semiconductor layer. The electrodes are arranged between the first conductive layer and the interconnection layer in a first direction perpendicular to the first conductive layer. The interconnection layer includes a first interconnection and a second interconnection. The semiconductor layer extends through the electrodes in the first direction, and is electrically connected to the first conductive layer and the first interconnection. The device further includes a memory film between each of the electrodes and the semiconductor layer, and a conductive body extending in the first direction. The conductive body electrically connects the first conductive layer and the second interconnection, and includes a first portion and a second portion connected to the second interconnection. The second portion has a width wider than the first portion.


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