The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Aug. 30, 2017
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Philipp Kreuter, Regensburg, DE;

Andreas Biebersdorf, Regensburg, DE;

Christoph Klemp, Regensburg, DE;

Jens Ebbecke, Rohr in Niederbayern, DE;

Ines Pietzonka, Donaustauf, DE;

Petrus Sundgren, Lappersdorf, DE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 24/96 (2013.01); H01L 24/83 (2013.01); H01L 24/95 (2013.01); H01L 25/0753 (2013.01); H01L 33/0095 (2013.01); H01L 2224/95085 (2013.01); H01L 2224/95145 (2013.01); H01L 2924/12041 (2013.01);
Abstract

A method of aligning semiconductor chips in a medium includes providing an electrically insulating liquid medium; providing semiconductor chips; forming a suspension with the medium and the semiconductor chips; exposing the semiconductor chips to electromagnetic radiation that generates free charge carriers in the semiconductor chips; arranging the suspension in an electric field in which the semiconductor chips are aligned along the electric field; and curing the medium after aligning the semiconductor chips.


Find Patent Forward Citations

Loading…