The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Sep. 26, 2017
Shanghai Micro Electronics Equipment (Group) Co., Ltd., Shanghai, CN;
Xiaoyu Jiang, Shanghai, CN;
Hai Xia, Shanghai, CN;
Feibiao Chen, Shanghai, CN;
Song Guo, Shanghai, CN;
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD., Shanghai, CN;
Abstract
A batch bonding apparatus and bonding method. The bonding apparatus comprises: a chip supply unit () for providing a chip () to be bonded; a substrate supply unit () for providing a substrate; a transfer unit () for transferring the chip () between the chip supply unit () and the substrate supply unit (); and a pickup unit () disposed above the chip supply unit (), for picking up the chip () from the chip supply unit () and uploading the chip () to the transfer unit () after flipping a marked surface of the chip () in a required direction. In the present invention pickup of each chip is completed individually, but transfer processes and bonding processes can be carried out for multiple chips at the same time, greatly increasing yield.