The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Feb. 25, 2019
Denso Corporation, Kariya, Aichi-pref., JP;
C. Uyemura & Co., Ltd., Osaka, JP;
Tomohito Iwashige, Kariya, JP;
Kazuhiko Sugiura, Kariya, JP;
Kazuhiro Miwa, Nagoya, JP;
Yuichi Sakuma, Nagoya, JP;
Seigo Kurosaka, Hirakata, JP;
Yukinori Oda, Hirakata, JP;
DENSO CORPORATION, Kariya, JP;
C. Uyemura & Co., Ltd., Osaka, JP;
Abstract
A semiconductor device includes: a semiconductor element; a support as a metallic member that includes a metallized layer having a first component as an iron group element and a second component as a periodic table group five or group six transition metal element other than chromium provided at an outermost surface of the support, and is arranged such that the outermost surface faces the semiconductor element; a joint material that is arranged between the outermost surface of the support and the semiconductor element, and is joined with the outermost surface to fix the semiconductor element to the support; and a molding resin that is arranged to cover a joint body having the support, the joint material and the semiconductor element.