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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10763162 B1

PDFFull Text
Date of Patent:
Sep. 01, 2020

Filed:

May. 28, 2019

Interconnect structure of semiconductor device

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chia-Ching Tsai, Tainan, TW;

Yi-Wei Chiu, Kaohsiung, TW;

Li-Te Hsu, Shanhua Township, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Anthony Ho

Assistant Examiner:

Kevin Quinto

Int. Cl.
CPC ...
H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76832 (2013.01); H01L 21/76804 (2013.01); H01L 21/76807 (2013.01); H01L 21/76813 (2013.01); H01L 21/76834 (2013.01); H01L 21/76879 (2013.01);
Abstract

A device includes a substrate, a first dielectric layer over the substrate, a first conductive feature in the first dielectric layer, and an etch stop layer over the first dielectric layer. The etch stop layer includes metal-doped aluminum nitride. The device further includes a second dielectric layer over the etch stop layer, and a second conductive feature in the second dielectric layer. The second conductive feature extends into the etch stop layer and contacts the first conductive feature.

Find Patent Forward Citations

Tsai, Chia-Ching. (2020). Interconnect structure of semiconductor device (U.S. Patent No. 10763162). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10763162

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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