The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

May. 23, 2019
Applicant:

Utechzone Co., Ltd., New Taipei, TW;

Inventors:

Chien-Wen Huang, New Taipei, TW;

Po-Tsung Lin, New Taipei, TW;

Chih-Heng Fang, New Taipei, TW;

Assignee:

UTECHZONE CO., LTD., New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G02B 21/36 (2006.01); G02B 21/06 (2006.01); H04N 5/33 (2006.01); H04N 5/225 (2006.01); G02B 27/48 (2006.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67288 (2013.01); G02B 21/06 (2013.01); G02B 21/365 (2013.01); H04N 5/2254 (2013.01); H04N 5/2256 (2013.01); H04N 5/33 (2013.01); G02B 27/48 (2013.01);
Abstract

A semiconductor defects inspection apparatus for inspection of bubble defects of an object is provided. The semiconductor defects inspection apparatus includes a carrier, an optical system, an infrared image capturing device, and a processing unit. The carrier is adapted for bearing the object. The optical system provides an illumination beam to the object to produce an image beam. The infrared image capturing device is disposed on a transmission path of the image beam. The infrared image capturing device is adapted for receiving the image beam to be transformed into an image information. The processing unit is electrically connected to the infrared image capturing device and adapted for analyzing the object according to the image information.


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