The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Mar. 17, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Niraj Merchant, San Francisco, CA (US);

Lara Hawrylchak, Gilroy, CA (US);

Mehran Behdjat, San Jose, CA (US);

Dietrich Gage, San Jose, CA (US);

Christopher Dao, San Jose, CA (US);

Binh Nguyen, San Jose, CA (US);

Michael P. Kamp, San Ramon, CA (US);

Mahesh Ramakrishna, Bengaluru, IN;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G01J 5/00 (2006.01); G01J 5/34 (2006.01); G01R 35/00 (2006.01); H01L 21/66 (2006.01); H05B 1/02 (2006.01); H05B 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67248 (2013.01); G01J 5/0003 (2013.01); G01J 5/0007 (2013.01); G01J 5/34 (2013.01); G01R 35/00 (2013.01); H01L 21/67103 (2013.01); H01L 22/20 (2013.01); H05B 1/02 (2013.01); H05B 1/0233 (2013.01); H05B 3/0019 (2013.01);
Abstract

Embodiments of the disclosure relate to methods for measuring temperature and a tool for calibrating temperature control of a substrate support in a processing chamber without contact with a surface of the substrate support. In one embodiment, a test fixture with a temperature sensor is removably mounted to an upper surface of a chamber body of the processing chamber such that the temperature sensor has a field of view including an area of the substrate support that is adjacent to a resistive coil disposed in the substrate support. One or more calibration temperature measurements of the area of the substrate support are taken by the temperature sensor and simultaneously one or more calibration resistance measurements of the resistive coil are taken corresponding to each calibration temperature measurement. Temperature control of a heating element disposed in the substrate support is calibrated based on the calibration temperature and calibration resistance measurements.


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