The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Jul. 12, 2018
Applicant:
Lam Research Corporation, Fremont, CA (US);
Inventors:
Stephen J. Banik, II, Portland, OR (US);
Bryan L. Buckalew, Tualatin, OR (US);
Frederick Dean Wilmot, Gladstone, OR (US);
Robert Rash, West Linn, OR (US);
Assignee:
Lam Research Corporation, Fremont, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
C25B 9/08 (2006.01); C25B 9/10 (2006.01); C25B 15/08 (2006.01); C25D 21/14 (2006.01); C25D 17/00 (2006.01); C25D 21/04 (2006.01);
U.S. Cl.
CPC ...
C25D 21/14 (2013.01); C25D 17/00 (2013.01); C25D 21/04 (2013.01);
Abstract
Electroplating results can be improved by dynamically controlling the pressure in different parts of an electroplating apparatus. For example, a number of plating problems can be avoided by ensuring that the pressure in an anode chamber always remains slightly above the pressure in an ionically resistive element manifold, both during electroplating and during non-electroplating operations. This pressure differential prevents the membrane from stretching downward into the anode chamber.