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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10759971 B1

PDFFull Text
Date of Patent:
Sep. 01, 2020

Filed:

Apr. 29, 2016

Adhesive composition for semiconductor, adhesive film for semiconductor, and dicing die bonding film

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Hee Jung Kim, Daejeon, KR;

Se Ra Kim, Daejeon, KR;

Jung Hak Kim, Daejeon, KR;

Seung Hee Nam, Daejeon, KR;

Jung Ho Jo, Daejeon, KR;

Kwang Joo Lee, Daejeon, KR;

Young Kook Kim, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:

Rothwell, Figg, Ernest & Manbeck, P.C.

Primary Examiner:

Maria V Ewald

Assistant Examiner:

Zachary M Davis

Int. Cl.
CPC ...
B32B 7/02 (2019.01); C09J 7/00 (2018.01); B32B 27/28 (2006.01); B32B 27/42 (2006.01); B32B 15/08 (2006.01); B32B 27/06 (2006.01); B32B 15/09 (2006.01); B32B 27/30 (2006.01); B32B 27/34 (2006.01); B32B 27/18 (2006.01); B32B 27/24 (2006.01); B32B 27/16 (2006.01); B32B 15/085 (2006.01); B32B 27/08 (2006.01); C09J 7/10 (2018.01); C09J 201/00 (2006.01); C09J 7/20 (2018.01); B32B 7/06 (2019.01); H01L 23/00 (2006.01); C08L 63/00 (2006.01); C09D 163/00 (2006.01); B32B 27/20 (2006.01); B32B 15/082 (2006.01); B32B 27/26 (2006.01); B32B 7/12 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 27/38 (2006.01); C09J 163/00 (2006.01); C09J 163/04 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); C09J 161/12 (2006.01);
U.S. Cl.
CPC ...
C09J 7/00 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/082 (2013.01); B32B 15/085 (2013.01); B32B 15/09 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/24 (2013.01); B32B 27/26 (2013.01); B32B 27/281 (2013.01); B32B 27/285 (2013.01); B32B 27/286 (2013.01); B32B 27/288 (2013.01); B32B 27/302 (2013.01); B32B 27/304 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); B32B 27/42 (2013.01); C08L 63/00 (2013.01); C09D 163/00 (2013.01); C09J 7/10 (2018.01); C09J 7/20 (2018.01); C09J 163/00 (2013.01); C09J 163/04 (2013.01); C09J 201/00 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 23/00 (2013.01); H01L 24/29 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2270/00 (2013.01); B32B 2307/306 (2013.01); B32B 2307/50 (2013.01); B32B 2307/51 (2013.01); B32B 2307/558 (2013.01); B32B 2307/58 (2013.01); B32B 2307/732 (2013.01); B32B 2405/00 (2013.01); B32B 2457/14 (2013.01); B32B 2553/00 (2013.01); C09J 161/12 (2013.01); C09J 2201/162 (2013.01); C09J 2201/36 (2013.01); C09J 2203/326 (2013.01); C09J 2423/006 (2013.01); C09J 2433/00 (2013.01); C09J 2433/006 (2013.01); C09J 2461/00 (2013.01); C09J 2463/00 (2013.01); C09J 2467/005 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68377 (2013.01); H01L 2221/68381 (2013.01); H01L 2221/68386 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/066 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/2064 (2013.01); H01L 2924/20102 (2013.01); H01L 2924/20103 (2013.01); H01L 2924/20104 (2013.01); H01L 2924/20641 (2013.01); H01L 2924/20642 (2013.01); H01L 2924/20643 (2013.01);
Abstract

The present invention relates to an adhesive composition for a semiconductor including: a thermoplastic resin having a glass transition temperature of −10° C. to 20° C.; a curing agent containing a phenol resin having a softening point of 70° C. or more; a solid epoxy resin; and a liquid epoxy resin, wherein a weight ratio of the total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, an adhesive film for a semiconductor including the adhesive composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive composition for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.

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