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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10758998 B1

PDFFull Text
Date of Patent:
Sep. 01, 2020

Filed:

Dec. 07, 2017

Dividing method of workpiece and laser processing apparatus

Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Hiroaki Yamada, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer Burns & Crain, Ltd.

Primary Examiner:

Lori L Baker

Int. Cl.
CPC ...
B23K 26/02 (2014.01); B23K 26/08 (2014.01); B23K 26/364 (2014.01); B23K 26/40 (2014.01); H01L 21/78 (2006.01); H01L 21/67 (2006.01); B23K 26/359 (2014.01); B23K 26/60 (2014.01); B23K 26/70 (2014.01); H01L 33/00 (2010.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/02 (2013.01); B23K 26/08 (2013.01); B23K 26/0876 (2013.01); B23K 26/359 (2015.10); B23K 26/364 (2015.10); B23K 26/40 (2013.01); B23K 26/60 (2015.10); B23K 26/70 (2015.10); H01L 21/67092 (2013.01); H01L 21/67144 (2013.01); H01L 21/78 (2013.01); B23K 2103/50 (2018.08); H01L 33/0095 (2013.01);
Abstract

A dividing method of a workpiece includes a dicing tape sticking step of sticking a dicing tape to the workpiece. A first laser processing step includes irradiating the workpiece with a laser beam with such a wavelength as to be absorbed by the workpiece along a first direction to form first laser-processed grooves. A first expanding step includes expanding the dicing tape in a second direction to enlarge the width of the first laser-processed grooves. A second laser processing step includes irradiating the workpiece with the laser beam with such a wavelength as to be absorbed by the workpiece along the second direction to form second laser-processed grooves, and a second expanding step includes expanding the dicing tape in the first direction to enlarge the width of the second laser-processed grooves.

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