The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Dec. 25, 2015
Intel Corporation, Santa Clara, CA (US);
Mao Guo, Shanghai, CN;
Intel Corporation, Santa Clara, CA (US);
Abstract
A microelectronic structure () and a fabrication method of microelectronic are described. A first package () has a first conductive pad () formed on a first foundation layer (). A loop of conductive wire (-) is wirebonded to the first conductive pad (() of the first foundation layer (). A mold cap () is formed on the first foundation layer (). A via (-) is formed in the mold cap () to reach the conductive wire (-). A solder structure (-) is coupled to the conductive wire (-). A second package () is connected to the first package () by attaching a second solder structure (-) of a second package () to the first solder structure (-) of the first package ().