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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10755902 B1

PDFFull Text
Date of Patent:
Aug. 25, 2020

Filed:

May. 25, 2016

Plasma processing apparatus and focus ring

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Hiroki Kishi, Miyagi, JP;

Jisoo Suh, Miyagi, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Jeffrie R Lund

Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01); H01L 21/3065 (2006.01); H01L 21/67 (2006.01); H05H 1/46 (2006.01); H01L 21/02 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32642 (2013.01); H01L 21/3065 (2013.01); H01L 21/6831 (2013.01); H01L 21/68735 (2013.01); H01L 21/02315 (2013.01); H01L 21/32136 (2013.01); H01L 21/67069 (2013.01); H01L 21/67109 (2013.01); H01L 21/6835 (2013.01); H05H 1/46 (2013.01);
Abstract

A plasma processing apparatus includes a chamber, a mounting tableand a focus ring. The chamber is configured to process a semiconductor wafer W with plasma. The mounting tableis provided within the chamber, and includes a holding surfaceon which the semiconductor wafer W is mounted. The focus ringis provided to surround the semiconductor wafer W mounted on the holding surface, and includes a first flat portion, a second flat portionand a third flat portionwhich are formed in sequence from an inner circumferential side of the focus ringtoward an outer circumferential side thereof. Here, the first flat portionis lower than the holding surface, the second flat portionis lower than the first flat portion, and the third flat portionis higher than the first flat portion

Find Patent Forward Citations

Kishi, Hiroki. (2020). Plasma processing apparatus and focus ring (U.S. Patent No. 10755902). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10755902

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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