The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

Jul. 29, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jason Zse-Cherng Lin, Saratoga, CA (US);

Shauh-Teh Juang, Saratoga, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 13/02 (2006.01); G05B 19/418 (2006.01);
U.S. Cl.
CPC ...
G05B 13/0265 (2013.01); G05B 19/41875 (2013.01); G05B 2219/32199 (2013.01); G05B 2219/32205 (2013.01); G05B 2219/37224 (2013.01); G05B 2219/45031 (2013.01); Y02P 90/14 (2015.11); Y02P 90/22 (2015.11); Y02P 90/26 (2015.11);
Abstract

A system for auto defect screening using adaptive machine learning includes an adaptive model controller, a defect/nuisance library and a module for executing data modeling analytics. The adaptive model controller has a feed-forward path for receiving a plurality of defect candidates in wafer inspection, and a feedback path for receiving defects of interest already screened by one or more existing defect screening models after wafer inspection. The adaptive model controller selects data samples from the received data, interfaces with scanning electron microscope (SEM) review/inspection to acquire corresponding SEM results that validate if each data sample is a real defect or nuisance, and compiles model training and validation data. The module of executing data modeling analytics is adaptively controlled by the adaptive model controller to generate and validate one or more updated defect screening models using the model training and validation data according to a target specification.


Find Patent Forward Citations

Lin, Jason Zse-Cherng. (2020). Auto defect screening using adaptive machine learning in semiconductor device manufacturing flow (U.S. Patent No. 10754309). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10754309

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