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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10752714 B1

PDFFull Text
Date of Patent:
Aug. 25, 2020

Filed:

Nov. 30, 2016

Resin composition

Applicant:

Nissan Chemical Industries, Ltd., Tokyo, JP;

Inventors:

Isao Adachi, Funabashi, JP;

Takahiro Sakaguchi, Funabashi, JP;

Yuki Sugawara, Funabashi, JP;

Assignee:

NISSAN CHEMICAL INDUSTRIES, LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
B05D 1/38 (2006.01); B05D 3/02 (2006.01); C08L 25/08 (2006.01); C08L 33/06 (2006.01); C08L 63/00 (2006.01); C08F 212/08 (2006.01); G03F 7/09 (2006.01); C08K 5/134 (2006.01); G02B 3/00 (2006.01); C08F 220/18 (2006.01); C08F 220/32 (2006.01); G03F 7/00 (2006.01); C09D 133/06 (2006.01); C08F 220/30 (2006.01); C08G 59/18 (2006.01); G02B 1/04 (2006.01); G03F 7/40 (2006.01); G02B 1/18 (2015.01); C08J 3/24 (2006.01); C08J 5/18 (2006.01); C08K 5/13 (2006.01); C08K 5/1575 (2006.01);
U.S. Cl.
CPC ...
C08F 212/08 (2013.01); C08F 220/18 (2013.01); C08F 220/30 (2013.01); C08F 220/32 (2013.01); C08G 59/18 (2013.01); C08J 3/24 (2013.01); C08J 5/18 (2013.01); C08K 5/13 (2013.01); C08K 5/134 (2013.01); C08K 5/1345 (2013.01); C08K 5/1575 (2013.01); C09D 133/068 (2013.01); G02B 1/04 (2013.01); G02B 1/041 (2013.01); G02B 1/18 (2015.01); G02B 3/00 (2013.01); G03F 7/0007 (2013.01); G03F 7/094 (2013.01); G03F 7/40 (2013.01); C08F 2800/20 (2013.01); C08F 2810/20 (2013.01); C08J 2325/14 (2013.01);
Abstract

There is provided a thermosetting resin composition. A resin composition, comprising: (A) component, (B) component, and a solvent, wherein the content of the (B) component is 0.1 to 5.0% by mass with respect to the content of all components of the resin composition, except the solvent: wherein Ris each independently a hydrogen atom or a methyl group, X is —O— or —NH—, Ris a single bond or an alkylene group, Ris an alkyl group, a is an integer of 1 to 5, b is an integer of 0 to 4, Ris a divalent organic group having an ether bond and/or an ester bond, Ris an alkyl group, f is an integer of 1 to 5, g is an integer of 0 to 4, Ris a single bond or an alkylene group, Y is a single bond or an ester bond, A is a mono- to tetra-valent organic group which optionally contain at least one hetero atom, or a hetero atom, and h is an integer of 1 to 4.

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