The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

May. 29, 2017
Applicant:

Arisawa Mfg. Co., Ltd., Niigata, JP;

Inventors:

Takayuki Mayama, Niigata, JP;

Naoki Suzuki, Niigata, JP;

Takashi Miwa, Niigata, JP;

Shuichi Fujita, Niigata, JP;

Kenji Nakamura, Niigata, JP;

Assignee:

Arisawa Mfg. Co., Ltd., Joetsu-shi, Niigata, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/088 (2006.01); B32B 7/12 (2006.01); B32B 27/34 (2006.01); B29C 65/48 (2006.01); B29C 65/00 (2006.01); B32B 37/12 (2006.01); H05K 1/03 (2006.01); B29C 65/02 (2006.01); B32B 15/20 (2006.01); B32B 38/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B32B 15/088 (2013.01); B29C 65/02 (2013.01); B29C 65/4815 (2013.01); B29C 66/00141 (2013.01); B29C 66/1122 (2013.01); B29C 66/45 (2013.01); B29C 66/71 (2013.01); B29C 66/73117 (2013.01); B29C 66/742 (2013.01); B29C 66/91943 (2013.01); B29C 66/91945 (2013.01); B29C 66/929 (2013.01); B32B 7/12 (2013.01); B32B 15/20 (2013.01); B32B 27/34 (2013.01); B32B 37/12 (2013.01); B32B 37/1207 (2013.01); B32B 38/0036 (2013.01); H05K 1/03 (2013.01); B29C 66/7422 (2013.01); B29C 66/74281 (2013.01); B29C 66/74285 (2013.01); B29C 66/949 (2013.01); B29L 2031/3425 (2013.01); B32B 2037/1223 (2013.01); B32B 2250/05 (2013.01); B32B 2266/045 (2013.01); B32B 2309/02 (2013.01); B32B 2309/04 (2013.01); B32B 2309/12 (2013.01); B32B 2309/62 (2013.01); B32B 2309/68 (2013.01); B32B 2311/12 (2013.01); B32B 2377/00 (2013.01); B32B 2379/08 (2013.01); B32B 2457/08 (2013.01);
Abstract

A method for manufacturing a flexible metal-clad laminated plate includes the steps of: (a) obtaining a laminated body by laminating a polyimide resin film including a non-thermoplastic polyimide layer and an adhesive layer containing thermoplastic polyimide, the adhesive layer being provided on at least one side of the non-thermoplastic polyimide layer, and a metal foil; and (b) subjecting the laminated body obtained in the step (a) to heat treatment under an inert gas atmosphere and a pressure of 0.20 to 0.98 MPa at a temperature of a glass transition temperature Tg of the thermoplastic polyimide−20° C. to the glass transition temperature Tg+50° C.


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