Three-dimensional memory device containing bond pad-based power supply network for a source line and methods of making the same

Abstract

A memory die includes an alternating stack of insulating layers and electrically conductive layers located over a substrate, memory stack structures extending through the alternating stack, source regions located on, or in, the substrate, and at least one memory-side bonding pad electrically connected to the source regions. A logic die includes a power supply circuit configured to generate a supply voltage for the source regions, and at least one logic-side bonding pad electrically connected to the power supply circuit through a network of logic-side metal interconnect structures. The memory die is bonded to the logic die. The network of logic-side metal interconnect structures distributes source power from the power supply circuit over an entire area of the memory stack structures and transmits the source power to the memory die through bonded pairs of memory-side bonding pads and logic-side bonding pads.