The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Sep. 09, 2015
Applicant:
Nexperia B.v., Nijmegen, NL;
Inventors:
Paul Huiskamp, Wijchen, NL;
Godfried Henricus Josephus Notermans, Hamburg, DE;
Assignee:
Nexperia B.V., Nijmegen, NL;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 27/02 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 23/522 (2013.01); H01L 24/05 (2013.01); H01L 27/0292 (2013.01); H01L 23/5222 (2013.01); H01L 23/53223 (2013.01); H01L 23/53257 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05091 (2013.01); H01L 2224/05096 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13147 (2013.01);
Abstract
The present disclosure relates to a semiconductor device comprising a metallisation stack. The metallisation stack may include a first metallisation layer and a second metallisation layer. The first metallisation layer may be electrically connected to the second metallisation layer by a two or more stacked inter-metal vias.
Huiskamp, Paul. (2020). Metallisation for semiconductor device (U.S. Patent No. 10748847). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10748847
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile