The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Feb. 27, 2017
Shanghai Micro Electronics Equipment (Group) Co., Ltd., Shanghai, CN;
Yuebin Zhu, Shanghai, CN;
Feibiao Chen, Shanghai, CN;
Hai Xia, Shanghai, CN;
Bin Yu, Shanghai, CN;
Song Guo, Shanghai, CN;
Yaping Ge, Shanghai, CN;
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD., Shanghai, CN;
Abstract
A chip bonding device is disclosed, including a first motion stage (), a second motion stage (), a chip pickup element (), a transfer carrier (), a chip adjustment system (), a bonding stage () and a control system (). A chip bonding method is also disclosed, in which a set of chips are temporarily retained on the transfer carrier () and their positions on the transfer carrier () are accurately adjusted by using the chip adjustment system (), followed by bonding the chips on the transfer carrier () simultaneously onto the substrate (). With this batch bonding approach, flip-chips can be bonded with greatly enhanced efficiency. Moreover, picking up and bonding chips in batches can balance times for chip picking up, fine chip position tuning and chip bonding, thereby ensuring high bonding accuracy while increasing the throughput.