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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10747198 B1

PDFFull Text
Date of Patent:
Aug. 18, 2020

Filed:

Aug. 17, 2015

Solder inspection apparatus and method of generating feedback information of solder inspection apparatus

Applicant:

Koh Young Technology Inc., Seoul, KR;

Inventors:

Jeong Yeob Kim, Seoul, KR;

Sa Woong Kim, Gwangmyeong-si, KR;

Assignee:

KOH YOUNG TECHNOLOGY INC., Seoul, KR;

Attorney:

Kile Park Reed & Houtteman PLLC

Primary Examiner:

Gregory J Toatley, Jr

Assistant Examiner:

Terence E Stifter, Jr

Int. Cl.
CPC ...
G05B 19/4065 (2006.01); B41F 15/08 (2006.01); B41F 33/00 (2006.01); B41F 15/26 (2006.01); H05K 3/12 (2006.01); B41F 15/12 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
G05B 19/4065 (2013.01); B41F 15/0881 (2013.01); B41F 15/12 (2013.01); B41F 15/26 (2013.01); B41F 33/0036 (2013.01); B41F 33/0081 (2013.01); H05K 3/1216 (2013.01); H05K 3/1233 (2013.01); B41P 2215/112 (2013.01); G05B 2219/32204 (2013.01); G05B 2219/45026 (2013.01); H05K 3/3484 (2013.01); H05K 2203/163 (2013.01);
Abstract

A feedback information generation method for a solder inspection apparatus includes: receiving an input of information on the number of buffers which are disposed between the solder inspection apparatus and a screen printer for printing solder on printed circuit boards and are configured to support the printed circuit boards to be introduced into the solder inspection apparatus so as to put the printed circuit boards on standby; generating feedback information by using the input information and an inspection result of the printed circuit boards by the solder inspection apparatus; and transmitting the feedback information to the screen printer. Feedback information may be generated in consideration of the number of buffers, thereby preventing the feedback information from being excessively generated as well as ensuring the accuracy of the feedback information.

Find Patent Forward Citations

Kim, Jeong. (2020). Solder inspection apparatus and method of generating feedback information of solder inspection apparatus (U.S. Patent No. 10747198). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10747198

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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