The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Mar. 02, 2016
Applicant:
Shengyi Technology Co., Ltd., Guangdong, CN;
Inventors:
Assignee:
Shengyi Technology Co., Ltd., Guangdong, CN;
Primary Examiner:
Int. Cl.
CPC ...
C09J 171/12 (2006.01); C08L 71/12 (2006.01); H05K 1/03 (2006.01); C08J 5/24 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C08G 77/20 (2006.01); C08G 65/48 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
C09J 171/12 (2013.01); C08J 5/24 (2013.01); C08L 71/126 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); H05K 1/0353 (2013.01); C08G 65/485 (2013.01); C08G 77/20 (2013.01); C08J 2371/12 (2013.01); C08J 2483/07 (2013.01); H05K 1/0237 (2013.01); H05K 1/0366 (2013.01); H05K 1/0373 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0162 (2013.01);
Abstract
The present invention relates to a polyphenyl ether resin composition and a use thereof in a high-frequency circuit substrate. The polyphenyl ether resin composition comprises a vinyl-modified polyphenyl ether resin and an organic silicon resin containing unsaturated double bonds and having a three-dimensional net structure. The high-frequency circuit substrate of the present invention has a high glass-transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate of high-speed electronic equipment.