The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Nov. 10, 2015
Applicant:
At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Inventors:
Nick Renaud-Bezot, Leoben, AT;
Bernhard Reitmaier, Möderbrugg, AT;
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/007 (2013.01); B81B 7/008 (2013.01); B81B 7/0061 (2013.01); B81B 7/0064 (2013.01); B81B 7/0067 (2013.01); B81C 1/00301 (2013.01); B81C 1/00873 (2013.01); B81B 2201/02 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2201/03 (2013.01); B81B 2201/036 (2013.01); B81B 2201/04 (2013.01); B81B 2201/042 (2013.01); B81B 2201/05 (2013.01); B81B 2201/10 (2013.01); B81B 2207/012 (2013.01); B81B 2207/095 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/0785 (2013.01); B81C 2203/0792 (2013.01);
Abstract
A package includes a support structure having an electrically insulating material, a microelectromechanical system (MEMS) component, a cover structure having an electrically insulating material and mounted on the support structure for at least partially covering the MEMS component, and an electronic component embedded in one of the support structure and the cover structure. At least one of the support structure and the cover structure has or provides an electrically conductive contact structure.