The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Oct. 17, 2016
Shin-etsu Handotai Co., Ltd., Tokyo, JP;
Kazuya Sato, Nasushiobara, JP;
Hiromasa Hashimoto, Nishigo-mura, JP;
Naoki Kamihama, Nishigo-mura, JP;
SHIN-ETSU HANDOTAI CO., LTD., Tokyo, JP;
Abstract
The present invention provides a method for polishing a wafer including, after unloading and before loading to hold a next wafer to be polished: measurement to measure a depth PDof a concave portion of a template after taking out a polished wafer; calculation to calculate a difference ΔPD between the measured depth PDof the concave portion and a depth PDof the concave portion of the template before being used for polishing; and adjustment to adjust polishing conditions for a next wafer to be polished in accordance with the calculated difference ΔPD. Consequently, there are provided the method for polishing a wafer and a polishing apparatus which enable adjusting a fluctuation in flatness of each wafer caused due to a fluctuation in numerical value of a pocket depth of a template.