The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Mar. 30, 2018
Applicants:

Te Connectivity Corporation, Berwyn, PA (US);

Tyco Electronics Japan G.k., Kawasaki-shi, JP;

Inventors:

Jeffery Walter Mason, North Attleboro, MA (US);

Takeshi Nakashima, Kanagawa, JP;

Naoki Hashimoto, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 12/82 (2011.01); H05K 7/10 (2006.01); G06F 1/18 (2006.01); H05K 3/34 (2006.01); H01R 43/02 (2006.01); H01R 13/11 (2006.01); H01R 12/52 (2011.01); H01R 12/58 (2011.01); H01R 12/61 (2011.01); H01R 12/70 (2011.01); H01R 12/79 (2011.01); H01R 12/85 (2011.01); H01R 13/24 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01R 13/05 (2006.01); H01R 12/71 (2011.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01R 12/82 (2013.01); G06F 1/184 (2013.01); H01R 12/52 (2013.01); H01R 12/585 (2013.01); H01R 12/61 (2013.01); H01R 12/7005 (2013.01); H01R 12/7076 (2013.01); H01R 12/79 (2013.01); H01R 12/85 (2013.01); H01R 13/057 (2013.01); H01R 13/11 (2013.01); H01R 13/111 (2013.01); H01R 13/2442 (2013.01); H01R 43/0256 (2013.01); H05K 1/0203 (2013.01); H05K 1/0243 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 3/3436 (2013.01); H05K 7/1084 (2013.01); H01L 23/4006 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4062 (2013.01); H01L 2023/4081 (2013.01); H01L 2023/4087 (2013.01); H01R 12/716 (2013.01); H01R 13/2464 (2013.01); H05K 2201/044 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10325 (2013.01); H05K 2201/10393 (2013.01); H05K 2201/10704 (2013.01); H05K 2201/10719 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A socket connector includes a socket assembly having a socket substrate and socket contacts. The socket substrate has first and second upper mating areas and a first lower mating area. The socket substrate has first and second socket substrate conductors at the first and second upper mating areas, respectively, and third socket substrate conductors at the first lower mating area electrically connected to corresponding first socket substrate conductors. The first socket substrate conductors are electrically connected to an electronic package, the second socket substrate conductors are electrically connected to an electrical component and the third socket substrate conductors are electrically connected to a host circuit board. The socket assembly is configured to electrically connect the electronic package with both the host circuit board and the electrical component. The socket contacts have a terminating end terminated to corresponding first socket substrate conductors and a mating end mated to package contacts.


Find Patent Forward Citations

Mason, Jeffery. (2020). Socket connector assembly for an electronic package (U.S. Patent No. 10741951). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10741951

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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