The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Nov. 09, 2018
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Brent A. Anderson, Jericho, VT (US);
Huiming Bu, Glenmont, NY (US);
Terence B. Hook, Jericho, VT (US);
Xuefeng Liu, Schenectady, NY (US);
Junli Wang, Slingerlands, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 27/02 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0274 (2013.01); H01L 29/66666 (2013.01); H01L 29/7827 (2013.01);
Abstract
A method of fabricating a semiconductor device includes forming one or more fins on a substrate. The method includes forming a first active area and a second active area, each including an n-type dopant, on the substrate at opposing ends of the one or more fins. The method further includes forming a third active area including a p-type dopant on the substrate adjacent to the first active area and the second active area.