The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

May. 20, 2019
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Wei Zhou, Boise, ID (US);

Bret K. Street, Meridian, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/495 (2006.01); H01L 23/552 (2006.01); H01L 23/48 (2006.01); H01L 25/00 (2006.01); H01L 23/04 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/04 (2013.01); H01L 23/36 (2013.01); H01L 23/481 (2013.01); H01L 23/4952 (2013.01); H01L 23/49541 (2013.01); H01L 23/552 (2013.01); H01L 24/16 (2013.01); H01L 25/50 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01);
Abstract

A semiconductor device includes a first die; a first metal enclosure directly contacting and vertically extending below the first die, wherein the first metal enclosure peripherally encircles a first enclosed space; a second die directly contacting the first metal enclosure opposite the first die; a second metal enclosure directly contacting and vertically extending below the second die, wherein the second metal enclosure peripherally encircles a second enclosed space; and an enclosure connection mechanism directly contacting the first metal enclosure and the second metal enclosure for electrically coupling the first metal enclosure and the second metal enclosure.


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